<track id="5dpno"><div id="5dpno"><td id="5dpno"></td></div></track>

    <bdo id="5dpno"></bdo>

    <menuitem id="5dpno"></menuitem><tbody id="5dpno"><div id="5dpno"></div></tbody>
     > Products & Solution > Grinding & polishing

    This machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.

     

    PRINCIPLES OF EQUIPMENT:

    The upper and lower grinding discs rotate in opposite directions.The movement of the workpiece is both revolutionary and self-rotating.Both sides are evenly grounded,the grinding resistance is small and does not damage the workpiece.

     

    MAIN FEATURES:

    ·The main structure of the machine adopts a one-time forming process, and the reasonable structure greatly improves the rigidity of the machine.

    ·Set each relevant parameter directly through the touch screen.The LCD touch screen displays the current working state and related setting parameters in real time.The system provides 500 data storage.Menu-style operation is convenient and quick.

    ·Stepless variable frequency for speed-regulating, stable start&stop without impact. The upper and lower grinding discs are equipped with a fast rise and fall, a slow rise and a slow down function.Effectively reduce product scrap rate.

    ·Efficient and stable transmission system which with helical gear has low noise.

    ·Upper grinding disc automatically leveling,Effectively solve the wrong disk problem.The upper grinding disc has self-locking function,further improvement in safety performance.

    ·Reduce center gear diameter and increase processing area, Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing.Save energy while improving production efficiency.

    ·The sun gear and the inner ring gear move synchronously,meeting the requirements of picking and placing workpieces and adjusting the meshing position of the carrier.

    ·Fully lubricated the opposite moving surfaces with a centralized lubrication system.

     

    型號Model

    單位Unit

    設計值

    研磨盤尺寸Plate size

    mm

    1053*530*45

    最小研磨厚度Min.workpiece thickness

    mm

    0.4

    游星輪片數量Number of carriers

    7片(柱銷式)

    最大研磨直徑Max. Workpiece diameter

    mm

    Φ280

    下磨盤轉速Lower plate rotational speed

    rpm

    2-45(無極調速)(Stepless change speed)

    加工件精度Machined work piece precision

    在來料平行度0.005以內時保證平行度0.005,表面粗糙度不

    大于Ra0.15μm,拋光件Ra0.125μm

    The parallelism is 0.005 when the parallelism of the

    incoming material is 0.005, the surface roughness is not more than Ra0.15μm, the polishing piece Ra0.125μm

    主電機Main motor power

    380V/15Kw/1450rpm

    下研磨盤跳動Lower plate run out

    mm

    0.05

    修正輪修正平行度Correction wheel correction parallelism

    mm

    0.005

    外形尺寸Overall dimension

    mm

    1800*1400*2680

    機器重量Machine weight

    Kg

    3200