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     > Products & Solution > Grinding & polishing

    This machine is mainly used in mobile phones of non-metallic materials such as glass and ceramics. 2.5D, 3D cover polishing. And also for metal material back cover such as aluminum alloy.

     

    MAIN FEATURES:

    ·Adopting 4 station structure, three-station polishing can realize the rough, medium-precision and precision three-stage process in one machine.

    ·Rotating lower polishing plate can realize non-stop loading and unloading to improve equipment efficiency.

    ·Easy to install, automatic liquid discharge, stable and reliable polishing.

    ·Flexible loading system for efficient polishing of hard and brittle parts.·Touch screen man-machine interface, PLC control, friendly interface, large amount of information.

    設備行程(磨組導軌上銀)

    Equipment stroke (grinding group guide:HIWIN)

     

    X軸行程150(mX 軸行程 150(mm)、X-axis stroke

    Y 軸行程 150(mm) 、Y-axis stroke

    Z 軸行程 150mm  Z-axis stroke

    設備移動速度Equipment movement speed

     

    X 10 /min、 Y 10 /min 、Z 10 /min

    X axis 10M/Min、Y axis 10M/Min、Z axis 10M/Min

    定位精度positioning accuracy

    ±0.02/150mm

    重復定位精度Repeatability

    ±0.03/150mm

    進口CNC控制系統Imported CNC control system

    12  axis

    工件數量Number of workpieces

    4

    磨頭數量Number of grinding heads

    3

    加工范圍Processing range

    5kgf/cm2

    氣壓Air pressure

    11kw 100r/min

    電壓Voltage

    380V/50HZ

    功率power

    7.5KW

    設備外形尺寸(長×寬×高)Equipment dimensions (L×W×H)

    1980×1450×1980mm

    設備重量Equipment weight

    2000KG